The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a (APSUNY_PDKv2.5a). This latest release expands the comprehensive set of Silicon Photonics Integrated Circuit (PIC) component libraries within SUNY Poly’s process capabilities to...
The New York State Photonics Board of Officers (NYS Photonics Board) announced today that tool installation has begun on schedule at the American Institute for Manufacturing Integrated Photonics (AIM Photonics) Test, Assembly and Packaging (TAP) Facility in Rochester. In addition, AIM Photonics forecasts the facility renovation will be completed $3...
-led Technology Information Session to Highlight Updated, State-of-the-Art Process Design Kit, Multi-Project Wafer Capabilities, in Addition to TAP Facility and Overall Initiative Updates
Integrated Photonics Wafer
(AIM Photonics), led by the ...
The today announced the winner of a proposal call for a new Defense Department Government Directed Project for photonic integrated circuit (PIC) data links for cryogenic focal plane arrays (FPAs). The project will encompass the design, fabrication and testing of cryogenic...
